INTERSTEL TECHNOLOGIES ATTENDS DEFENSE TECHCONNECT
Washington, D.C. (November, 2023) - Interstel Technologies™ attended the Defense TechConnect Innovation Summit and Expo in Washington, D.C. from November 27th through the 29th. Our conference attendees, consisting of CEO Dr. Trevor Sorensen, Vice President of Technology Eric Pilger, and Software Engineer Lynzee Hoegger, met with numerous representatives of many key companies and organizations in the defense sector. Through these meetings, many new opportunities and applications for our products were discovered. Thank you to all who stopped by our booth. During this conference, Interstel also competed in both the NASA Entrepreneurs Challenge and the Space Innovation Challenge and came home as a finalist in both. Interstel congratulates our fellow University of Hawai’i spin-off company Mahina Aerospace for their win in the Space Innovation Challenge. Though this is Interstel Technologies’ last conference appearance in 2023, we hope to see you all again in the coming year.
Interstel Technologies™ CEO Dr. Trevor Sorensen (left), VP of Technology Eric Pilger (not pictured), and Software Engineer Lynzee Hoegger (right) demonstrating iCOSMOS-Swarm at the company booth at Defense TechConnect Innovation Summit and Expo
